What you might want to know

  • Rumors recommend Google’s Tensor G3 chip might characteristic a FO-WLP packaging technique out of Samsung’s Foundry.
  • The tactic is claimed to encourage energy effectivity whereas additionally lowering warmth technology for the Pixel telephones.
  • Google’s Tensor chip hasn’t had the very best popularity, and the corporate is reportedly trying to transfer to TSMC for the Tensor G4 earlier than subsequent yr’s Pixel.

There is likely to be a bit of extra in retailer for Google’s upcoming third-generation chip inside its subsequent smartphone launch.

Rumored by Tech_Reve on X, Google’s personal Tensor G3 chip may characteristic FO-WLP packaging, one of many first to take action out of Samsung’s Foundry (through 9to5Google). The brand new technique, which stands for “Fan-out Wafer-level,” would encourage energy effectivity and cut back warmth generated from the system.