What you might want to know
- Rumors recommend Google’s Tensor G3 chip might characteristic a FO-WLP packaging technique out of Samsung’s Foundry.
- The tactic is claimed to encourage energy effectivity whereas additionally lowering warmth technology for the Pixel telephones.
- Google’s Tensor chip hasn’t had the very best popularity, and the corporate is reportedly trying to transfer to TSMC for the Tensor G4 earlier than subsequent yr’s Pixel.
There is likely to be a bit of extra in retailer for Google’s upcoming third-generation chip inside its subsequent smartphone launch.
Rumored by Tech_Reve on X, Google’s personal Tensor G3 chip may characteristic FO-WLP packaging, one of many first to take action out of Samsung’s Foundry (through 9to5Google). The brand new technique, which stands for “Fan-out Wafer-level,” would encourage energy effectivity and cut back warmth generated from the system.
It was beforehand anticipated that Google would proceed to depend on Samsung to craft the semi-custom chips. Nevertheless, sure features nonetheless stay unsure. That stated, a change to the Tensor G3’s core structure is anticipated as Google tries to work some extra energy into the chip.
Moreover, there was hypothesis that the corporate would proceed to characteristic the identical modem because the Tensor G2 within the upcoming iteration.
The Tensor G3 is the primary amongst Samsung Foundry’s smartphone chips to include FO-WLP packaging, which is anticipated to cut back warmth technology and enhance energy effectivity for the Tensor G3.September 11, 2023
Google’s personal chip has had its (many) faults since its debut, starting from effectivity issues to overheating. Most notable is the slight rework given to the Tensor G2 chip for the Pixel 7a, the place Google decided to switch up the packaging technique for the chip in its most up-to-date price range cellphone, making the system run severely hotter and slower.
There’s a risk that these issues will go away — or, a minimum of, not be such an issue sooner or later. Rumors in July urged Google might possibly drop Samsung for its Tensor G4 chip, which might possible energy the Pixel 9 collection. Google would go from counting on Samsung Semiconductors to piggybacking off TSMC.
A change like this might significantly profit the corporate’s enough Tensor chip, as Qualcomm’s shift to TSMC was like night time and day when evaluating the Snapdragon 8 Gen 1 and Snapdragon 8+ Gen 1. Google additionally has plans to totally produce its Tensor chip in-house by 2025.
We’ve got three weeks till Google reveals the Pixel 8 collection throughout its fall occasion on October 4. The wait’s not lengthy now till we see how these modifications to the Tensor G3 affect the following Pixel collection.